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2

Pan, G. W., J. A. Prentice, S. K. Zahn, A. J. Staniszewski, W. L. Walters, and B. K. Gilbert, The Simulation of High-Speed, High-Density Digital Interconnects in Single Chip Packages and Multichip Modules, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(4):465-477 (August) 1992.